SuperM.O.L.E.^® Temperature Profiler

• SuperM.O.L.E.^® Gold
• Xpert Ready SuperM.O.L.E.® Gold (same specifications as above)
  • Hardware and Software ready to upgrade to the complete AutoM.O.L.E.®Xpert System
  • Includes the Xpert Charging Station
• M.O.L.E.® scan Specs
  • Use your ovens computer and the stationary MOLEscan to profile your oven. Click here to learn more

More Information

• SuperM.O.L.E.^® Software
• M.O.L.E.^® Tips
• Tech Tips
• AutoM.O.L.E.®
• Profile Planner

Technical Articles

• New Papers given at APEX
  **SMT Rework Machines - Capability, Repeatability and Verification of in-service performance
  **Lead Free Reflow Process Control
  **Oven Characterization Using Machine Quality Management (MQM) Tools
• The ECD AutoM.O.L.E.®Xpert system is featured in the November issue of Assembly Magazine.
  * Jack Schreiner at Universal Avionics (Norcross,GA) successfully transferred the recipes from an existing reflow oven to a new oven in two profiling passes. Throughput was improved by 19 centimeters per minute on the first try. This equates to a 40 percent increase in throughput from an oven with 26 percent less thermal capacity than the one it replaced. Time for overall product profiling changeover was cut from 2 to 3 hours per assembly to 30 minutes.
• Reflow Solder Profile Development
• Thermal Profiling in Reflow Soldering
• Bringing, and keeping, machine soldering under control
• Robust Reflow Profile Design
• SMEMA - Reflow Terms and Definitions
• SMT Article on AutoM.O.L.E(r)Xpert "Beta Test: Can Software Create a Self-Profiling Reflow Oven?" Benchmark Electronics puts the Xpert to the TEST and gets RESULTS.
• Circuits Assembly Articles on Improving the Assembly Process with SPC This 3 part article show the importance of Oven calibration and the quality and cost improvements that come from this important step
• SMT Article by Ray Prasad One Solder Profile for all Boards? Developing a unique profile for each product is a one-time effort and the benefits of lower defects last as long as that board is built.
• EP&P Article titled "Reflow Technology Ready for Lead-free Challenge" Equipment innovation and upgrades, plus strategic partnering, prepare manufacturers to meet new technology challenges. - Learn more about the importance of Profiling using the Lead-free process.
• EP&P Article, "Profiling: Past, Present and Future Applications" For thermal processing to run at top efficiency, it is important to optimize the different types of profiling equipment and understand how they complement each other
• EMS group urges component makers to go lead free - Article from EBN June 7, 2002 By Claire Serant
• Selecting Material and Process Parameters for Lead Free SMT Soldering Using Designs of Experiments Techniques - Word Document
  • by: Dr. Sammy Shina and Hemant Belbase - Dept of Mech Eng, U of Massachusetts Lowell
  • Karen Walters - BTU International
  • Tom Bresnan - Sanmina Corp, Tech Center East
  • Peter Biocca, Tim Skidmore - Multicore Solder
  • David Pinsky - Raytheon Corp
  • Phil Provencal - Solectron Massachusetts Corp
  • Don Abbott - Texas Instruments
  • Published at Apex 2001 - San Diego
• Design of Experiments for Lead Free Materials, Surface Finishes and Manufacturing Processes of Printed Wiring Boards - Word Document
  • by: Dr. Sammy Shina and Hemant Belbase - Dept of Mech Eng, U of Massachusetts Lowell
  • Karen Walters - BTU International
  • Tom Bresnan - Sanmina Corp, Tech Center East
  • Peter Biocca, Tim Skidmore - Multicore Solder
  • David Pinsky - Raytheon Corp
  • Phil Provencal - Solectron Massachusetts Corp
  • Don Abbott - Texas Instruments
  • Published at SMTA - Chicago 2000
• Lead -Free Research: Optimizing Solder Joint Quality - Word Document
  • by: Tim Skidmore and Karen Walters
  • Published in Circuit Assembly - April 2000
• PIHR process and Paper by Bob Willis
  Pin-in-hole, intrusive, pin-in-paste, multi-spot soldering are all terms used to describe a reflow process that allows through hole components to be soldered without the need for wave soldering or purchasing selective soldering systems. With the growing interest in lead-free soldering there is also a need to simplify the process stages in manufacture, particularly with many companies in Europe looking to adopt an environmentally friendly process.
• Volumetric Flow? Velocity? Configuration? Which One Determines Heat Transfer Efficiency in Convection Furnaces? - Power Point Presentation
  • by: Pierre LeMieux
  • BTU International, Inc.
• Technical Abstract from Nerac

What is a M.O.L.E.^®?

A Mole is a small battery powered temperature recording device that is designed to provide a great deal of sophisticated time and temperature information.

M.O.L.E.^® stands for Multichannel Occurrent Logger Evaluator.

How does it work?

The M.O.L.E.^® uses Type K thermocouples to sense temperature information. Simply connect the thermocouples to the object to be profiled and turn on the M.O.L.E.^®.

After a preset time the M.O.L.E.^® will turn itself off. You then connect the M.O.L.E.^® to a PC and download the information. Special software takes the time and temperature information from the M.O.L.E.^® and displays it on your computer screen. You can view all the thermocouples simultaneously or select the ones you wish to display.

The software is designed to allow you to easily ascertain temperatures at any point in your process, the slopes amount of change in degrees per second at any points in your process, how long the object has spent above specific temperatures, average temperatures, standard deviation and much more!

Two versions of the M.O.L.E.^® are available.

SuperM.O.L.E. Gold Data Sheet 

SuperM.O.L.E. Gold RF Data Sheet  

AeroM.O.L.E. Data Sheet